DeerClean-NH series are polymer remover highly recommendable for batch cleaning method. They are hydroxylamine free and capable of removing post ashing residue under low temperature.

CMP-M and CMP-B series are Post CMP Cleaning Solution for Cu/low-k. They are capable of removing metal impurities, particles and organic substances after CMP cleaning without chemical attack on Cu and low-k.

NaOH-CX is special blend of Aqueous Sodium Hydroxide with chelating agents which is capable of inhibiting Fe, Ni and Cu impurities adsorption on the Si wafer during cleaning and etching process.

SEA series are etchant for Ag film effective in fine patterning in the process of forming Ag wiring and reflecting electrode of LCD and OLED.

ITO series are etchant for ITO and IZO film effective in fine patterning in the process of forming picture electrode.