Exhibition for SURTECH2010 | KANTO CHEMICAL CO.,INC.

Exhibition Information

KANTO CHEMICAL Co., Inc. will Exhibit at SURTECH 2010

KANTO CHEMICAL will exhibit Gold planting solution especially amorphous Au-Ni film which will be applied to novel purposes. Furthermore, newly developed electroless Gold planting solution for micro bump fabrication will also be displayed.
You are always welcome at our booth!

Exhibit Dates	Wednesday, July 28– Friday, July 30, 2010
Exhibition Hours	10:00 – 17:00
Exhibition site	East Hall 6, Tokyo Big Sight, Japan
Booth No.	M - 20

No.	Application	Product Name
1	Gold-Nickel Alloy Plating Solution for Electrodeposition	Aurexel AM
2	Electroless Hard Gold Plating Solution	Aurexel HG
3	Non-Cyanide Hard Gold Plating Solution for Electrodeposition	Aurexel FC
4	Electroless Gold Plating Solution for Micro Bump Fabrication	[ Under development ]

<Others: introduced with catalogs>

Ultra Pure Chemicals

Acids, Alkalis, Solvents

Functional Chemicals

Etchants, Cleaning Solutions

The reagent for material research

Ultra-Fine Nano Particles

RoHS Reagent Chemicals

Kanto Chemical Co., Inc.
Technical Development
Electronic Materials Division
TEL：+81-3-3667-6811
FAX：+81-3-3667-0440
E-mail：el-info@gms.kanto.co.jp

＜Exhibit Booth Information>
EAST HALL 6, Tokyo Big Sight　< Booth No. M – 20 >