EZ(S) series
- Effectively removes adhesive residue left behind after peeling semiconductor tapes used in dicing (DC) and backgrinding (BG) processes.
- Minimizes damage to electrode materials (such as Cu) and insulating films.
- Formulated without NMP, DMSO, or TMAH to prioritize worker safety and reduce environmental impact.
Product Line
| Products | pH | Dilution ratio | Processing temperature (℃) |
|---|---|---|---|
| EZ(S)-01 | Alkaline | Undiluted | Room temperature |
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