Cu series
- Cu series is mixed acid type etchant for Cu thin film. (strongly acidic)
- Capable of controlling etching rate of Cu by the etchant composition or temperature.
- Cu-03 can reduce the amount of side etching.
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Product Line
| Products | Etching rate （25℃、nm/min.） |
Features | Treatment method |
|---|---|---|---|
| Cu-01 | 650（No stirring） | For fine patterns | Dipping |
| Cu-02 | 1,100（Strong stirring） | For fine patterns | Dipping and spray |
| Cu-03 | 350（Strong stirring） | For extremely fine patterns | Dipping and spray |
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