Si etchant
- NaOHLM-CX can suppress metal adsorption on the wafer during etching.
Product Line
| Products | Composition | Features |
|---|---|---|
| 48%-potassium hydroxide solution | 48% KOH |
Low metal impurities |
| 48%-sodium hydroxide solution | 48% NaOH |
Low metal impurities |
|
NaOHLM-CX |
NaOH with an additive |
For Si wafer |
| NaOHLM | 48% NaOH |
For Si wafer |
| TMAH-22 | 22% TMAH |
Low metal impurities |
| TMAH-25 | 25% TMAH |
Low metal impurities |
TMAH：Tetra Methyl Ammonium Hydroxide
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