Aurexel MD
- Cyanide-free electroless Au plating solution and capable of forming micro-bump.
- Capable of treating condition of neutral pH and low temperature and excellent operability and safety.
- Capable of embedding and via sidewall thick plating.
- Au plating speed is 2μm/hr and its hardness is 80~90Hk.
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Au bump with φ10μm and height 10μm |
Cross section after FIB processing |
Product Line
| Products | Temperature（℃） | pH | Features |
|---|---|---|---|
| Aurexel MD | 50～60 | 7.0～7.5 | Cyanide-free |
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