Aurexel MD

      • Cyanide-free electroless Au plating solution  and capable of forming micro-bump.
      • Capable of treating condition of neutral pH and low temperature and excellent operability and safety.
      • Capable of embedding and via sidewall thick plating.
      • Au plating speed is 2μm/hr and its hardness is 80~90Hk.

Aurexel MD①jpg   Aurexel MD②jpg

Au bump with φ10μm and height 10μm
 
Cross section after FIB processing

Product Line

Products Temperature(℃) pH Features
Aurexel MD 50~60 7.0~7.5 Cyanide-free



Contact Us

E-mail Inquiry Form

Inquiry Form

Telephone

+81-3-6214-1081