JELK series
- Even resists and dry film resists after ion implantation that are difficult to strip with conventional amine-based strippers can be stripped.
- This series of products do not contain hydroxylamine and NMP.
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| Before processing |
NMP 60℃ 15 min. |
JELK-205 60℃ 5 min. |
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Product Line
| Products | Features | Selectivity | Processing temperature （℃） |
Rinse |
|---|---|---|---|---|
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JELK-100 series |
Excellent selectivity with metals and resins such as polyimide |
Al-Cu, SiN, SiO2, Ti, TiN, Cr, Co, Ni, Cu, GaN, Ag, IGZO, TaN, W, Au, and so on |
25～70 |
Water |
|
JELK-200 series |
Superior balance between stripping |
Water or IPA |
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JELK-400 series |
Compatible with ultrasonic processes | |||
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JELK-500 series |
For stripping dry film resist |
SiN, SiO2, Ti, TiN, Cr, Ni, Cu, TaN, Au, and so on |
Water |
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