JELK series
- Post-etching residue remover capable of removing organic and metallic residues without damaging various metal materials.
- Large amounts of residue adhered after thick-film wiring pattern formation, such as in power devices, can also be removed.
- This series of products does not contain hydroxylamine and NMP.
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Before processing |
After processing |
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Cleaning performance (JELK-101) Substrate structure: TiN/Al-Cu/TiN/TEOS, Temperature: 60℃, Time period: 30 min., Method: Dip (left to stand) |
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Product Line
| Products | Features | Selectivity | Processing time (min.) |
Rinse |
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| JELK-100 series |
Excellent metal corrosion protection and high selectivity for resins (Polyimide and PBO) |
Al-Cu, SiN, SiO2, Ti, TiN, Cr, Co, Ni, Cu, GaN, Ag, IGZO, TaN, W, Au, and so on |
25～70 |
Water |
| JELK-200 series |
Superior balance between stripping performance and corrosion protection performances |
Water |
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